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Virtual Lab: Minilab ‐ Lithography
University of Virginia
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The wafer is dipped in the developer solution and slowly tilted back and forth. This mild agitation ensures that fresh developer can reach the bottom of the windows in which the photoresist, weakened by exposure, is being dissolved.

At the end of development, the mask pattern should be seen in the photoresist film on the wafer. The developing time is 50 sec.

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