The final bays contain equipment for depositing metals and CMP (chemi mechanical polishing). These are used in the new "damascene" metallization process:
Copper is deposited entirely across a grooved wafer surface. Careful polishing then removes all of the metal except that which fell into the grooves. This remaining metal gives the desired pattern in a process that echoes that used in the decoration of jewelry (as developed long ago in Damascus Syria - hence the name "damascene").
